Backplane
Backplane Assembly Amphenol Printed Circuit Board Technology • Press-Fit • Automated Press-fit • Automated Xray Solder Joint Evaluation • BGA/Hot Gas Rework System • Jet Soldering • Automated Soldering • Fine-pitch/SMT • ESS Thermal Cycling Chambers • Automated Conformal Coating Application • Automated continuity/isolation testing • Potting/Encapsulation • Continuous Wave Soldering
Due to technical progress, all information provided is subject to change without prior notice Designed by Amphenol Socapex
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