Amphenol Socapex │ SIHD
SIHD>>> SIGNAL CONTACTS & GROUND STRIP TECHNOLOGY ( & ) MALE CONTACTS FOR RECEPTACLES WITHOUT GROUND STRIP
Straight solder PC tail
L
L
- Thru hole soldering - Mother board - PCB thickness: up to 4.3 ± 0.3 [.169 ± .012]
M1YD
Termination style
L
M1YD
L
L
L
5.3 ± 0.3 [.209 ± .012]
Termination section
Ø 0.5 ± 0.03 [.020 ± .001] 1.2 x 0,6 [.024 x .047] 2 [.080] Ni + 1 [.039] Au
Mating end size
Active contact area plating µm [µin]
2 [.080] Ni + 3 [.118] SnPb or bright pure Sn for RoHS version
Termination plating µm [µin]
A
Plan originel ECHELLE
DESSIN: le
Amphenol Socapex
1,000
TECHNIQUE:
BP 29 - 74311 THYEZ CEDEX
1/1
GROUND STRIP TECHNOLOGY
Ground strip bene ts
- Reduced cross talk level - Impedance 70Ω to 120Ω - Reduced self impedance level - Capacitance distributed along signal contacts
Central ground strip technology
Arrangements available: 102 & 204 signal contacts & 230 signal contacts with half central ground strip Compatibility: M1YD, F1YL, F1U1, F1U2 & F1U3
Note: ground strip has the same termination and active contact area platings as the contacts with which its mounted
Due to technical progress, all information provided is subject to change without prior notice Designed by Amphenol Socapex
31
A
Plan originel ECHELLE
DESSIN: le
Amphenol Socapex
1,000
TECHNIQUE:
BP 29 - 74311 THYEZ CEDEX
1/1
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