ECOC Exhibition 2024 Show Guide

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ECOC EXHIBITION

Exhibition 23 - 25 September 2024

SHOW GUIDE

14 Market Focus Timetable 32 ECOC Industry Awards 34 Product Focus Timetable 42 Exhibitor Listings

ECOC Exhibition FREE WiFi Network name & password: ECOC2024

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Frontend and Backend Networks

Visit Marvell at stand B113 Happy Hour: 23 September, 15:30-17:00 at our stand

CONTENTS

Message from the Sponsor

Our Sponsors and Media Partners Welcome from the Organiser Message from the Conference Chair General Exhibition Information

4 5 7 9

Venue Overview Exhibition Floorplan

10 - 11 12 - 13

Dear attendees and delegates,

On behalf of myself and the entire team behind Optical Connections magazine, I would like to welcome you to the 50th European Conference on Optical Communications here in the vibrant city of Frankfurt on the banks of the river Main. It is gratifying to see that the combined Conference and Expo continues to be Europe’s largest event in the field and one of the most prestigious and enduring events for the global optical communications community. Over the last 12 months, advances in optical communications technologies have been quite breathtaking, and further developments are on the near horizon. From FTTH to the demands of hyperscale data centres and new network architectures, from chip-to-chip optical connectivity to high-density fibre infrastructure, all are subject to intense efforts to improve capacity and efficiency, while reducing power requirements and carbon footprints. The industry’s response to these issues is, as ever, innovation, with opto-electronics and photonics playing an increasingly important role. All of these technologies and more, will be on show at ECOC and you will have the opportunity to meet and discuss them with the myriad of companies, experts, academics, and industry thought leaders present at ECOC 2024. The ECOC Expo Industry Awards aim to celebrate the very best of these innovations and products and the 2024 winners will be announced live at the Product Focus theatre live at ECOC Exhibition on Tuesday 24th September. At Optical Connections, we take pride in our close links with the fibre optics industry. We endeavour to provide up to the minute commentary on the latest innovations and developments through thought leadership features and comment, written by industry experts from both long-established and up-coming companies, as well as industry organisations, analysts and leading journalists in the field. We are also proud to sponsor the ECOC 2024 Show Guide and support the team at Nexus Media Events Ltd. who work so hard to make the ECOC Expo such an on-going success year after year. I hope you enjoy the event and will take time to see the many demonstrations and new products on display, as well as attending the variety of Market Focus presentations which are carefully selected by the team of experts who make up the Market Focus Committee. ECOC 2024 will provide you with new insights and inspirations that will enable you to take the industry forward into what promises to be a fascinating and exciting future.

Sponsored by:

Market Focus

Market Focus Timetable

14 - 17

Market Focus Abstracts

18 - 26

Market Focus Speaker Bios

27 - 31

In conjunction with:

ECOC Awards

FTTx Focus

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Sponsored by:

OPEN XR

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Product Focus OPEN XR

FORUM

Product Focus Timetable

Product Focus Abstracts

35 - 38

Product Focus Speaker Bios

39 - 40

EPIC Job Wall DEMO Focus

41 41

Peter Dykes Contributing Editor Optical Connections

Exhibitor Listings

By Company Name

42 - 45

By Market Sector

47 - 56

By Other Market Sector

Meeting Rooms

ECOC 2024 is organised by Nexus Media Events Ltd Suite 3, Building 30, Churchill Square, Kings Hill, West Malling, Kent ME19 4YU United Kingdom t: +44 (0) 1732 752 126

Exhibitor Profiles

60 - 103

Sponsored by

THANK YOU TO OUR SPONSORS

OPEN XR

FORUM

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OPEN XR

FORUM

ECOC Exhibition 2024 Official Media Partners

Sponsored by

Welcome from the organisers Welcome to ECOC Exhibition 2024, Europe’s largest exhibition dedicated to fibre optic communication technology, and welcome to Frankfurt! Over 300 international exhibitors await you in the exhibition halls this year, along with our range of interactive features and seminars, all free to attend, to ensure you get the most out of your time at ECOC.

Exhibition Highlights Back for it's eighteenth year, the Market Focus theatre , sponsored by Acacia, now part of Cisco, will once again form a hub of discussion, with over 50 sessions as well as two panel discussions , Market Focus showcases the very latest news and developments from global leaders within the industry. As new technologies continue to emerge, and increased pressure is being placed on the networks than ever, the need for efficient and resilient optical networks has never been greater, Market Focus gives you a unique opportunity to hear the latest trends, exciting predictions and the next steps to be taken to achieve connectivity goals. See p14-17 for the full timetable and session details.

and related developments. The 2024 winners will be announced live in the Product Focus theatre on Tuesday 24th Semptember. See p32 for details on this year's award categories. The FTTx Focus area brings together the very latest fibre to the ‘x’ in a dedicated area, showcasing a range of products. The Demo Focus zone features a wide range of demonstrations, taking place on Tuesday 24th September 10:30 - 12:00. Find more details on p41. Don’t forget to join the conversation across the three days of the exhibition, by following on social media for previews, product launches, photos and highlights. Tweet us @ecoc_exhibition to share your own news, photos and event plans, and tag us using #ecoc2024 and we will reshare as many as we can. Thank you to our exhibitors, sponsors, partners, speakers and visitors for your continued support once again this year. We hope your time with us is well-spent and you find everything you are looking for. We look forward to welcoming you back next year for ECOC Exhibition 2025 in Copenhagen, Denmark.

Sponsored by:

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WORLDWIDE COVERAGE OF

LASERS, OPTICS, POSITIONING, SENSORS & DETECTORS, IMAGING, TEST & MEASUREMENT, SOLAR, LIGHT SOURCES, MICROSCOPY, MACHINE VISION, SPECTROSCOPY, FIBER OPTICS, MATERIALS & COATINGS

Welcome to the 50th European Conference on Optical Communication - ECOC 2024 in Frankfurt, Germany!

Selected highlights from the extensive technical programme at ECOC 2024 are: • 8 in-depth tutorials, 52 invited presentations, 451 contributed papers as well post-deadline paper sessions featuring the latest breakthrough results. • 14 workshops on hot topics in the community, covering optical as well as quantum communication in fibre and free-space, addressing the device, system and network level. • Symposia on 50 years of ECOC, optical networking, optical satellite, green ICT and data-centre challenges. • A demo session covering proof of concepts and early prototype developments that can be seen as a link between the scientific conference and the business-driven exhibition. A lively rump session debating the innovation potential of quantum technologies as well as sessions covering the topics Hack your research!, Women in Photonics and Photonics in Germany. Don’t miss the chance to network and relax at our social events, including the welcome reception, the conference dinner and our special 50th anniversary celebration - a night filled with culinary delights reflecting the diverse countries that have contributed to ECOC’s rich history. We are delighted to host you here in Frankfurt and hope you enjoy both the technical sessions and the vibrant social atmosphere of ECOC 2024. Let’s celebrate 50 years of ECOC and look forward to the next chapter in optical communications together!

ECOC is one of the world's two largest and Europe's most prestigious conference in the field of optical communications, bringing together scientists, engineers and business leaders from across the globe. It’s more than just a conference - it’s a unique platform to share knowledge, exchange groundbreaking ideas, spark innovations and foster collaborations that drive science and the future of our industry. Alongside the conference, the collocated exhibition is the largest of its kind in Europe, offering unparalleled opportunities to explore the latest products, connect with new customers and discover emerging trends. This year’s ECOC features an outstanding lineup of plenary speakers, who offer visionary insights into the evolving landscape of optical communications: • Andreas Bechtolsheim, Co-Founder and Chief Architect of Arista Networks, Can Interconnects Keep Up with AI? • Thomas van Briel, SVP Architecture and Strategy Deutsche Telekom Technik GmbH, Evolution of IP and Optical Networks • Roel Baets, Emeritus Professor at Ghent University and former Group Leader at IMEC, Towards Silicon Photonics 4.0 • Joyce Poon, Head of Photonics Architecture at Lightmatter, Future Computing with Integrated Photonics Over the past 50 years, optical technologies have revolutionized global communications, shaping the digital world we know today. As we look into the future, these technologies will be even more crucial in driving the next wave of digital transformation. Join us to explore the latest research, innovations and business opportunities in this vibrant field.

General Chairs

Jörg-Peter Elbers Adtran Networks SE

Ronald Freund Fraunhofer HHI

Carmen Mas Machuca University of the Bundeswehr Munich

Peter Krummric Technical UniversityDortmund

Sebastian Randel Karlsruhe Institute of Technology

Sponsored by

GENERAL EXHIBITION INFORMATION

EXHIBITION OPENING HOURS Monday 23rd September 09:30 - 17:00 Tuesday 24th September 09:30 - 17:00 Wednesday 25th September 09:30 - 16:00

Organisers Office The organisers office is located at the back of Hall 5.1. See the venue overview for the location. Exhibition Admission ECOC 2024 conference delegates and visitors will be admitted free of charge upon presentation of an official ECOC badge. The organiser reserves the right to refuse admission without giving a reason or to expel any person or persons whose conduct is, in the opinion of the organisers, considered undesirable. Conference Admission Only ECOC 2024 delegates in possession of the official delegate badge will be admitted into the conference. Cloakroom Opening Times Monday 23rd 07:30 - 23:30 Tuesday 24th 07:30 - 20:00 Wednesday 25th 07:30 - 20:00

There will be free WiFi access available in the exhibition halls. Please note this will only be suitable for browsing the internet and is not suitable for downloading or streaming. Most mobile devices and laptops will be able to access the free WiFi service but we cannot guarantee access as it is dependent on the software that is installed on your portable device.

ECOC Exhibition FREE WIFI Network name & password: ECOC2024

Photography and videotaping Photography is prohibited on the exhibition floor. Any photography and videotaping must be approved by the exhibition organisers. Please visit the organiser’s office to submit your request.

Smoking & Drugs Smoking and drug taking are strictly prohibited inside the venue premises AT ALL TIMES. Children No person under the age of 18 years can be admitted to the exhibition, either during build-up, days or breakdown. This rule also applies to the exhibitor’s/delegates children. The organisers have a right to enforce it to comply with the safety regulations of the exhibitions

Copyright Protection As organisers we take a very strong view on Copyright infringement; any person reported infringing these rights will be immediately ejected from the exhibition. If a successful prosecution is brought by the affected company, a further ban would be imposed on the prosecuted person from attending future ECOC events.

Catering Locations & Times See pages 10-11 for Locations

Hall 5.1 – Delegate Coffee /Snack Bar

Hall 5.1 Snack Bar North

Foyer Café Bar

Hall 6.1 - Focus Bar

09:00-4.45pm When delegate coffee is not being served

09:00-4.45pm Hot & cold drinks, hot food, salads & sandwiches

09:00-4.45pm Hot & cold drinks, salads & sandwiches

Focus Bar to serve Alcohol , hot and cold drinks, salads & sandwiches

Hot & cold drinks, salads & sandwiches

IT’S GOOD TO SHARE! Share us your news and photos at the show...

@ECOC_Exhibition ecoc-exhibition

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Use these hashtags: #ecoc24 #ecocexhibition24 #optical #event #frankfurt #exhibition

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VENUE OVERVIEW

Contractor Service Desks

Organisers Office

Hall 6.1

Foyer Hall 5.1/6.1 Upper level Foyer Area

Hall 6.1 Upper level

Exhibitors Office

CONTRACTOR SERVICE DESKS

E37

MR M

MR27

MR28

MR29

PRESS OFFICE AND EXHIBITOR LOUNGE

E36 E35

E34

E33

E32 E31

E30

E29

E28

E27

C102

MR L

MR J MR K

MR21

MR26 MR25 MR24 MR23 MR22

D85 D84

D83

D81

D80

D79

D78

D77

D76

C101

C113 C112 C115 C114

C111

C110

C106

C103

C104

C108

DEMO AREA

Catering

B129

INNOVATION

D35 D34

D33

D32

D31 D30

D28

IF1 IF2 IF3

B135

B134

B133

B132

B130

B131

IF6 IF5 IF4

MR17

MR15

MR20

MR18 MR19

MR16

C83

C81

C80 C79

C77

F44

F43

F21

F3 F2 F1

B128

B127

B126

B125

B124 B123

B122

B113

FOCUS

F42

F45

F23 F20

B118

B116

B115

B114

B120

Posters

B83

B81

B80

C30

C29

C28

C27

F46

F40

F24 F19

MR9

MR14 MR13 MR12 MR11 MR10

F47

F25 F18

B79

B78

B77

B76

B112

B111

B110

B108

B106

B105

B86

F39

F17

B104

B103

B101

B100

F49 F38

F27 F16

A31 A30

B29

A26

B21

A24

A23

B28

F50 F37

F28 F15

A124

A131 A130 A133 A132

A128

A127

A126

A122

A121 A120

A118

MR B MR C MR D

MR8

MR7

MR6

MR5

MR4

MR3

A28

A22

A33

F51 F36

F29 F14

F54 F33

F30 F13

F10

A110

A117 A116

A115

A114

A111

A109

A32

F31 F11

Frankfurt (Main) Messe

FOCUS BAR

A106

A108

A107

A105

A101

A100

MR A

MR2

MR1

F32 F12

S- Bahn

Hall 6 – Height Restricted – 3.50m

Hall 6.1 Features • Posters • Exhibitor Meeting Rooms

Foyer • Snack Bar • FTTX • Stands F1 - F54

• Market Focus • Product Focus

• Focus Bar – Catering point • Exhibitor & Press Lounge

• Stands A100 – A133 • Stands B100 – B135 • Stands C100 – C115

Sponsored by

Hall 5.1

Hall 5.1 Upper level

Conference Sessions Upper level

Snack Bar

Illusion

ESKS

Taxi T

Fantasie

E21

E28

E27

E26 E25

E24 E23

D71

E20 E19

E18

E17

D60

E16

E15 E14

E13

E3 E2

E8 E7

D54

D49

D75 D74

D77

D76

D70

D72

D69 D68

D67

D58 D57

D55

D65

D64 D63

D62

D59

D56

D53

D52 D51

D50

D48

Conclusio

D28

D25 D24

D23 D22

C69

C67

D27

C75

D17

D16 C63

C60

C57

D5 D4

6 5 4

C49

C77

C73

C71

C76

C66

C65

C56

C55

C54 C53

C51

C50

Spektrum

C48

Harmonie 5

C47

Harmonie 4

C28

C27

C26 C25

B68

B71

C18

C17

B65

C13

B60

C10

B53

B52 C2

B49

Snack Point

B77

B76

B75 B74

B55

B54

B67

B66

B64 B63 B62

B59 B58 B57

B56

B51

B50

Media Center

B48

ECOC Exhibition

1st Floor

Harmonie 6

Harmonie 3

B21

A23

A19

A14

B12

A10

B17

A20

Harmonie 2

A22

A12

A17

Delegate coffee and Catering point

Harmonie 1

NEW REGISTRATIONS

Main Entrance

Conference Registration

Forum

SELF REGISTRATION

To Tram and Underground (Festhalle/Messe)

Exhibition Registration Upper level

Conference Registration Ground floor

Entrance

Hall 5.1 Features • Exhibition Registration • Delegate Coffee & Catering Point • Seating area • Snack Bar • Demo Focus

• Stands A1 – A33 • Stands B3 – B86 • Stands C0 – C83 • Stands D0 – D85 • Stands E1 – E37

Sponsored by

EXHIBITION FLOORPLAN

Hall 6.1

Foyer Area

E37

MR M

MR27 MR28 MR29

PRESS OFFICE AND EXHIBITOR LOUNGE

E36 E35

E34

E33

E32

C102

D85 D84

D81

D83

C101

C113C112 C115C114

C110

C103

C104

C111

C106

C108

DEMO AREA

CATERING

B129

D35 D34

D33

D31

D32

B134

B132

B130

B131

B135

B133

C83

C80

C81

F44

F43

F21

F3 F2 F1

B127

B126

B124B123

B113

B128

B125

B122

F42

F45

F23 F20

B118

B116

B115

B114

B120

B81

B83

F46

F40

F24 F19

F47

F25 F18

B111

B110

B108

B106

B105

B112

B86

F39

F17

B103

B101

B100

B104

F49 F38

F27 F16

A31 A30

B28

A26

B29

F50 F37

F28 F15

A131A130 A133A132

A126 A128 A127

A122

A121A120

A118

A124

A28

A33

F51 F36

F29 F14

F54 F33

F30 F13

F10

A117A116

A106 A115

A114

A111

A109

A32

A110

F31 F11

FOCUS BAR

MR A

MR2

MR1

A108

A107

A105

A101

A100

F32 F12

Sponsored by

Hall 5.1

SNACK BAR

E21

E3 E2

E16

E15 E14

E13

D71

E8 E7

E24 E23

E20 E19

E6 E5

E36 E35

E34

E33

E32 E31

E30 E29

E28

E27

E26 E25

E18 E17

D60

D49

D59

D56

D53

D52 D51

D50

D70

D65

D64 D63

D62

D55 D54

D85 D84

D81

D80

D79 D78

D75 D74

D72

D69 D68

D83

D77

D76

D67

D58 D57

D48

INNOVATION

D7 D6

D5 D4

D17

D16 C63

C60

C57

D28

C69

D25 D24

D23 D22

D35 D34

D33

D31 D30

D27

C75

D32

C67

IF1 IF2 IF3

IF6 IF5 IF4

C49

C56 C55

C54 C53

C51

C50

C66

C65

C77

C73

C71

C83

C80 C79

C76

C81

C48

FOCUS

C47

C18 C17 B65

C13

B60

C10

B53

B52 C2

B68

B81

B80

C30 C29

C26 C25

C28

C27

B83

B71

C6 C5

B49

B67 B66

B64 B63 B62

B59 B58 B57

B56

B51

B50

B79 B78

B75 B74

B77

B76

B55 B54

B48

A31 A30

A24

A23

A19

A14

B12

A10

B28

A26

B21

B29

B17

A20

A22

A12

A28

A17

Delegate Coffee and Catering Point

NEW REGISTRATIONS

SELF REGISTRATION

Connecting entrances in Halls

Entrance

Sponsored by

Now in its eighteenth year, the Market Focus theatre has continued to be one of the highlights of the ECOC Exhibition and a key place to get up-to-date knowledge from across the industry and discover the latest commercial trends in optical communications. This year we have streamlined our programme to cover the whole value chain of technologies, from optical components to optical network providers that span both telecommunications as well as data centre and data communication media services.

EXHIBITION HALL 6.1

Advisory Committee Members

Committee Chair:

Michael Lebby, Lightwave Logic

Stephan Neidlinger

ADTRAN

Sponsored by:

Wladek Forysiak

Aston University

Daryl Inniss

Industry Expert

Glenn Wellbrock

Verizon

Pierpaolo Ghiggino

Industry Consultant

Frank Chang

Source Photonics

Bill Ring

Vector Photonics

Karen Liu

Nubis Communications

Sponsored by:

Monday Morning: Modules/Sub Systems Start Finish Title

Presenter

Company

World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators The advantages of heterogeneous integrated photonic circuits for AI/ML applications. Endurance of Optical Pluggables Through 200T Switches Datacenter Optics in the Age of AI – Market Overview and Update Optical Compute Interconnect: Co-packaged optics for AI and compute infrastructure The opportunity and design challenges of 200G/ lane based 1.6T optical transceivers to meet demands of AI clusters Latest Status, Analysis and Specifications for Half-Retimed Pluggable Optics PICs Built for Interop: Consistent Link Performance with Integrated Optical Equalizer Navigating Optical Parallelism: Comb Lasers or Laser Arrays for Next-Generation Interconnects

10:00

10:15

Michael Lebby

Lightwave Logic Inc

OpenLight Photonics

10:20

10:35

Adam Carter

10:40

10:55

Mark Lutkowitz

fibeReality, LLC

11:00

11:15

Scott Wilkinson

Cignal AI

11:20

11:35

Christian Urricariet

Intel

11:40

11:55

Frank Chang

Source Photonics

12:00

12:15

Chris Cole

Coherent Corp.

12:20

12:35

Yosef Ben Ezra

NewPhotonics

12:40

12:55

Frank Smyth

Pilot Photonics

Monday Afternoon: Modules/Sub Systems

Start Finish Title

Presenter

Company

13:00

13:15 Optics for AI/ML Architectures

Mark Nowell

Cisco

13:20

13:35 Coherent Optics in the Datacenter

Karl Gass

OIF

Low-Power Interconnects for Next Generation Networks Novel coherent technology implementation approaches with 3nm-based 800Gb/s pluggables and 1.6Tb/s performance

13:40

13:55

Drew Guckenberger

MaxLinear, Inc.

14:00

14:15

Bilal Riaz

Ciena

PCB embedded waveguide based optical compute interconnects for ML & HPC applications.

14:20

14:35

Nikolaus Flöry

vario-optics

14:40

14:55 CMIS – Is Plug-and-Play Possible?

Doug Cattarusa

Cisco

Impact of AI/ML Applications on Network Hardware

15:00

15:15

Nathan Tracy

TE Connectivity

Futurewei Technologies

15:20

15:35 Next generation of fiber access

Frank Effenberger

15:40

15:55 Technologies for enabling the coherent edge

Joerg-Peter Elbers

Adtran

Interview -Nokia and Infineon – merger of two giants in our field – exploring the impact, trends and opportunities for the industry

16:00

16:30

Jose Pozo, Michael Lebby, David Welch

Tuesday Morning: Components/IC/PIC/Fiber Start Finish Title

Presenter

Company

Advances in Optical Components for Datacom and Telecom Transceivers Next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding (PWB) and Facet-Attached Micro- Optical Elements

10:00

10:15

Julie Eng

Coherent Corp.

10:20

10:35

Sebastian Skacel

Vanguard Automation

10:40

10:55 Is there any room for new oDSP vendor?

Mingyang Lyu

Nokia Shanghai Bell

Quantum dot lasers at 300 mm for silicon photonics and datacentre optical interconnect applications Energy Efficient Interfaces for the Next Generation of AI Compute: Market perspectives of O-band GaAs Quantum Dot devices 100G PAM4 Analog CDR for SFP112 modules – enabling 6G front haul architecture

11:00

11:15

Dr Ben Stevens

IQE

11:20

11:35

Jeff Hutchins

OIF

11:40

11:55

Alexey Kovsh

Alfalume

12:00

12:15

Raza Khan

Semtech

Advancing optical technologies toward 224Gbps/lane for AI

Huawei technologies co. Ltd, China

12:20

12:35

Haifeng Shao

Evolution of Optical Transport Networks: Innovations, Trends and Challenges of the next Decade

12:40

12:55

Sascha Vorbeck

Deutsche Telekom

Tuesday Afternoon: New and emerging technologies

Start Finish Title

Presenter

Company

Is the Future of LiDAR still so bright you have to wear shades? Coherent Optics for Low Earth Orbit (LEO) Satellites Communication: Present, Next, and Beyond

13:00

13:15

Chris Phare

Voyant

13:20

13:35

Jack Jian Xu

Coherent Corp.

13:40

13:55 Liquid cooled pluggable optical transceivers

Mike Bishop

Ciena

Technology Innovation Institute (TII)

14:00

14:15 2,3,4D Structured Light and Applications

Ravi K. Saripalli

Laser Precision: Advanced Optics and Sources Revolutionizing Automotive LIDAR

14:20

14:35

Sridhar Nagarajan

Coherent Corp.

14:40

14:55 Next Generation VCSEL devices for LPO and CPO Roman Koerner

TRUMPF

Multi-gigabit Optical Transceiver Design for Automotive Automotive LIDAR development empowered by simulation

15:00

15:15

Alberto Rodríguez Pérez

15:20

15:35

Steven Jones

CADFEM

Frank Chang (Moderator) Andy Bechtelsheim Julie Eng Guangcan Mi Di Zhang Craig Thompson

Source Photonics Arista Coherent Corp Huawei Data Center Group Kuaishou Technology Nvidia

Panel Session: Next gen networking optics like 1.6 or 3.2T

15:40

16:30

Sponsored by:

Wednesday Morning: Networking/Systems/Service provider Start Finish Title Presenter

Company

Silicon Photonics operating at 1.6 Tbps in an Immersion Cooling Environment

10:00

10:15

Ronnen Lovinger

DustPhotonics

10:20

10:35 Will You Need CPO In 3 Years?

Rajiv Pancholy

Broadcom Inc.

Advanced Optical Connectivity Solutions for AI/ML applications Energy Efficient Optics for Sustainable Scaling of AI Networks Optical networking engines for next generation of AI architectures

10:40

10:55

Rang-Chen Yu

Innolight

11:00

11:15

Brian Smith

Lumentum

11:20

11:35

Ana Gonzalez

iPronics

11:40

11:55 Data Center Interconnects in the Era of AI

Dr. Loi Nguyen

Marvell

12:00

12:15 Connections in AI Networks Inside the Data Center

Lisa Huff

Omdia

Karen Liu (Moderator) Samuel Kocsis Karl Muth Hacene Chaouch Tom Palkert

Nubis Communications Amphenol Broadcom Arista Macom

12:15

12:55 Panel Session: Linear Optics Comes of Age

Wednesday Afternoon: Networking/Systems/Service provider Start Finish Title Presenter

Company

Next-generation Transceivers Technology for the AI era

13:00

13:15

David Welch

Infinera

13:20

13:35 Path to carbon zero

Andrea Di Giglio

Telecom Italia

Huawei Technologies France S.A.S.U Fujitsu Networks Communications Inc.

Fibre-to-The-Room (FTTR): New Opportunity after FTTH

13:40

13:55

Tony Zeng

14:00

14:15 ILA Hut skipping for sustainability

Muhammad Sarwar

Evolution of Optical Interconnection in the Era of Intelligent Computing Networks

IPEC & China Telecom

14:20

14:35

Junjie Li

14:40

14:55 IP over DWDM Mythbusters

Lorenzo Ghioni

Cisco

Transitioning PON to Coherent Technology for 100G and beyond Optimized fiber connections and routing for Co- Packaged Optics (CPO) The need for speed: IP-optical integration with 800ZR/ZR+

15:00

15:15

Edward Walter

Ciena

Benoit Fleury Anand Ramaswamy

Corning Broadcom

15:20

15:35

15:40

15:55

Dirk van den Borne

Juniper Networks

Monday Morning: Modules/Sub Systems 10:00 – 10:15 Lightwave Logic Inc

10:40 – 10:55 fibeReality, LLC Endurance of Optical Pluggables Through 200T Switches Speaker: Mark Lutkowitz, fibeReality, LLC The overwhelming desire of the hypersclalers is to remain with pluggables effectively forever. While it seems to be clear that with 100T switches, the marketplace will stay comfortably with these optical devices, anticipation of the next-generation architecture is necessary. NVIDIA’s AI platform designs are instructive in showing the way for providing sufficient space for pluggable transceivers, in a future design of a 200T switch. The possibility of 512x400G/lane versus 1024x200G/ lane will be examined (along with the feasibility of 32×6.4 terabit plugs). The latest insights on vertical line cards and thin-film lithium niobate as potential enablers will be discussed as well. 11:00 – 11:15 Cignal AI Datacenter Optics in the Age of AI – Market Overview and Update Speaker: Scott Wilkinson, Cignal AI Datacenter optics growth rates have exploded as AI requires exponentially more connectivity and bandwidth. In this presentation, we track the unprecedented rise in datacenter optics shipments and forecast growth for the future based on hyperscale capex, end-user demand, and supplier capacity. As 1.6TbE modules begin shipping in volume, what does the future look like for 800GbE? Explosive growth cannot continue indefinitely, so when will growth in spending slow? What optics reaches and technologies will be required for next generation datacenters? Does the bandwidth growth inside the datacenter translate to bandwidth growth outside the datacenter, and will it drive Telecom growth? 11:20 – 11:35 Intel Optical Compute Interconnect: Integrated photonics AI infrastructure scaling will require very significant increases in bandwidth density, energy efficiency, and reach, which optical connectivity based on a new type of integrated photonics is well positioned to support. Optical Compute Interconnect (OCI) chiplets co- packaged with a CPU/GPU or other SOCs provide a compelling solution and support a roadmap for the decade ahead. The talk will describe our current views on the most optimized integration approaches and their implications on reliability, manufacturability, and performance scaling. 11:40 – 11:55 Source Photonics The opportunity and design challenges of 200G/lane based 1.6T optical transceivers to meet demands of AI clusters Speaker: Frank Chang, Source Photonics With the outbreak of large AI models and computing power requirements, the market demand for optical transceiver modules, especially high-end module products, is rapidly soaring. The market penetration of 100G per lane supports the growing demand for 400G and 800G connectivity in enabling the AI wave sparked by ChatGPT. We anticipate 2024 is the year of 800G optical transceivers, while 1.6T transceivers represent the near future, and will start dominating the market from beginning of 2026 by leveraging the 200G per lane. The networking industry has established 1.6T optical transceivers using DR8, 2xFR4 and even LR8 scenarios to cover intra-DC links of up to 10km in either OSFP or QSFP-DD packages. In this talk, we will investigate how to apply these well-established 4/8- lane optical packaging for emerging 800Gb/s (based on 4x200G) and 1.6Tb/s (based on 8x200G) applications. The opportunities and design challenges of 200G/lane based 1.6T optical transceivers will be discussed in great details towards its commercialization. for AI infrastructure scaling Speaker: Christian Urricariet, Intel

World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators Speaker: Michael Lebby, Lightwave Logic Inc Electro-optic (EO) polymer modulators are a hot topic in the industry today as the industry strives to increase modulation speed while reducing optical network equipment power consumption, driven by G-AI needs to upgrade hypescaler datacenters. Polymer modulators are now showing world class performance for 200Gbps PAM4 lanes, with initial results at 400Gbps PAM4 lanes and headroom for 800Gbps lanes as polymers have significant bandwidth capability. This enables not only 4 channel by 200Gbps PAM4 lanes for 800Gbps pluggable transceivers today, but also 4 channel by 400Gbps PAM4 lanes for 1.6Tbps pluggable transceivers soon. Further, polymer modulators have the capability for 4 channel by 800Gbps PAM4 lanes for 3.2Tbps pluggable transceivers using 800G lanes as part of a technology roadmap plan. Recent world class EO polymers results include: 1) Clean PAM4 eye diagrams at 200Gbps with less than 1V drive voltage. 2) Super high bandwidth polymer based plasmonic devices that exceed 250GHz (EO S21 3dB) for 400Gbps PAM4 lane applications for4 channel by 400Gbps PAM4 (1.6Tbps) pluggable transceivers. 3) Very low voltage drive of ~0.5V (which allows direct drive from ICs, DSPs etc., and potentially can eliminate driver chips) 4) Very small footprint and size, which allows simple integration with PICs to turbo-boost silicon photonics. Tiny optical engines are ideal for pluggable and onboard-optic transceiver form-factors. 5) Commercial silicon foundry 200mm wafers where EO polymers have been easily integrated using standard PDKs. The talk will discuss the latest world class results with commercial grade electro- optic polymer materials that are being licensed for device applications for datacom at 1310 and 1550nm. These devices are fabricated onto 200mm silicon commercial foundry wafers and perform to 200G lane specifications at drive voltages less than 1V (which supports the drive to lower power consumption). Packaged polymer modulators will show the latest reliability and lifetime performance for datacenter applications. Reliability and stability results will be presented to show the robustness of the technology platform with respect to thermal stability and photostability in testing on materials, packages, and boards. Plans for CSP (Chip Scale Packaging) for polymer PICs will be shown based on dielectric sealants such as Atomic Layer Deposition at temperatures suitable for organic, polymer material. The talk will also show how the performance of EO polymer modulators can extend to not only 800Gbps and 1.6Tbps transceivers, but also 3.2Tbps, 6.4Tbps and beyond using the natural bandwidth characteristics of Perkinamine® chromophore organic material family. With EO bandwidths that exceed 250GHz that have been demonstrated with Polariton, single line or lane data rates that exceed 800Gbps PAM4 possible which opens a path for multi-Tbps data rate pluggable transceiver designs that include 3.2Tbps and 6.4Tbps for an exciting technology roadmap using polymer materials. 10:20 – 10:35 OpenLight Photonics The advantages of heterogeneous integrated The explosion of AI/ML applications drives next generation network architectures to handle high bandwidth, high density, low power interconnects. At 800Gb the industry supply chain has struggled to provide the demand required using conventional manufacturing processes and equipment. This has further validated the need for higher levels of integration at silicon scale. We present the next phase of integration combining III-V active devices and passive silicon photonic circuits available in a Process Design Kit (PDK) at a commercial foundry. We will show results from our latest 1.6TB (8x200G) photonic integrated circuit utilizing our 200Gb electro absorption modulators. photonic circuits for AI/ML applications Speaker: Adam Carter, OpenLight Photonics

Sponsored by:

Monday Afternoon: Topic: Modules/Sub systems 13:00 – 13:15 Cisco Optics for AI/ML Architectures Speaker: Mark Nowell, Cisco

12:00 – 12:15 Coherent Corp. Latest Status, Analysis and Specifications for Half- Retimed Pluggable Optics Speaker: Chris Cole, Coherent Corp. A major development in optical datacom has been Linear Pluggable Optics (LPO) promising cost, power, and latency savings by eliminating DSPs from modules. OFC 2024 had multiple LPO presentations and booth exhibits. Parallel major development was the approval by the OIF at the Jan’24 meeting, of Retimed Tx Linear Rx (RTLR) project, which promises robust, fully interoperable optical and electrical pluggable module interfaces at reduced cost and power. The first draft is under review, with potential 100G/lane baseline adoption in Aug’24. This presentation will give the latest RTLR status, analysis and specifications, compare linear and half-retimed optics, and discuss schedule. 12:20 – 12:35 NewPhotonics PICs Built for Interop: Consistent Link Performance Today’s scaling challenges of optical interconnect offset the advantages of OSP in AI workload processing on data center infrastructure. The introduction of next-generation integrated photonic interconnect solutions deliver performance improvements in latency and power reduction, but a more pressing demand must still be met: multi-vendor interoperability. This presentation from NewPhotonics will show how the introduction of equalizer technology in the optical domain in both optical transceiver modules provide the link-consistent performance required for effective multi-vendor interoperability enabled by all optics signal processing. This PIC breakthrough ensures extended value for data center infrastructure investment in both performance and optimized TCO. 12:40 – 12:55 Pilot Photonics Navigating Optical Parallelism: Comb Lasers or Laser Arrays for Next-Generation Interconnects Speaker: Frank Smyth, Pilot Photonics With SERDES speed increases becoming increasingly challenging to achieve, greater levels of optical parallelism will be required to continue to grow interface rates. Comb lasers and laser arrays are two alternative light source approaches for this highly parallel future. In this talk we discuss the pros and cons of each and to which market application (transport, cloud datacentre, AI/Ml, etc) and interconnect approach (pluggables, co-packaged optics, optical I/O) each is best suited. with Integrated Optical Equalizer Speaker: Yosef Ben Ezra, NewPhotonics

Building networks to address the AI/ML workloads creates new and additional challenges for the optical module industry to enable optimized solutions. This presentation will cover many of the leading approaches that are being considered such as higher speed optics, higher speed ports, lower power and denser solutions and the consequent system design challenges. Learn how these solutions can potentially address escalating power and cost concerns associated with higher speeds.

13:20 -13:35 OIF Coherent Optics in the Datacenter Speaker: Karl Gass, OIF

OIF’s 400G coherent specification (400ZR) been a resounding success for interoperability. It’s time to provide an update on our next two generations of coherent specifications (800ZR, 800LR, 1600ZR, and 1600ZR+). We will provide an update on 800ZR and 800LR technical work as well as an early status on 1600ZR and ZR+, reviewing trade- offs in optical system performance, latency, and power, and innovations. These projects will create the next core network architecture based on coherent pluggable technology common in next generation Cloud DCI and Telecom edge network interconnects. 13:40 – 13:55 MaxLinear, Inc. Low-Power Interconnects for Next Generation Networks Speaker: Drew Guckenberger, MaxLinear, Inc. The massive scale of next generation AI and datacenter networks is driving a significant focus on interconnect power reduction. This is absolutely required to successfully build out networks at the scale these applications require. Multiple technologies are competing to provide the right power/performance/reach trade-offs throughout these networks, including DAC/ACC/AEC/LPO/LRO/fully retimed optics. In this presentation, the network requirements for interconnect power at each network tier will be discussed, the technology options to meet these requirements will be reviewed and the performance trade-offs associated with each will be explored; attempting to identify potential winners and losers across these next generation networks. 14:00 – 14:15 Ciena Novel coherent technology implementation approaches with 3nm-based 800Gb/s pluggables and As the industry strives to deliver tangible efficiency improvements in network scale, cost per bit and energy reduction, innovative technology approaches are required. This session describes new networking opportunities resulting from the use of 3nm CMOS-based design implementations for both 200GBaud 1.6Tb/s performance-optimized transceivers as well as 140GBaud 800Gb/s QSFP-DD800 and OSFP transceivers. 1.6Tb/s performance Speaker: Bilal Riaz, Ciena

Monday Afternoon continued: Topic: Modules/Sub systems 14:20 – 14:35 vario-optics PCB embedded waveguide based optical compute interconnects for ML & HPC applications Speaker: Nikolaus Flöry, vario-optics The expanding AI-driven market fuels the development of next-gen switch-to-server and GPU-to-GPU connectivity solutions in machine learning (ML) and high-performance computing (HPC) applications. Optical interconnects are prime candidates due to their ability to increase I/O speeds and lane densities within systems with tight size constraints. In this talk we present the realization of complete on-board end-to-end optical compute interconnects, based on PCB embedded optical waveguides with vertically coupled optical light engines. The system enables 100G low power on-board communication rendering it ideal for operation in standard protocols such as PCI Express.

15:20 – 15:35 Futurewei Technologies Next generation of fiber access

Speaker: Frank Effenberger, Futurewei Technologies PON systems are continuing to evolve to meet the requirements of new and existing applications. ITU-T SG15 is conducting a study on very high speed PON systems, which are expected to be the follow-on system to the 50 Gb/s High speed PON system. The VHSP study is considering all manner of issues, including the viability of IM-DD, the availability of optical spectrum, the maturity of coherent PONs, and even the suitability of distributed fiber optical sensing. This talk with give an overview and outlook on this project. 15:40 – 15:55 Adtran Technologies for enabling the coherent edge Speaker: Joerg-Peter Elbers, Adtran Fiber broadband pushes coherent transmission towards the network edge. This talk discusses network requirements and how open networking solutions can address these requirements in an energy- efficient and intelligent way. Interview – Nokia and Infineon – merger of two giants in our field – exploring the impact, trends and opportunities for the industry. Speakers: Jose Pozo, Optica; Michael Lebby, Lightwave Logic; David Welch, NosTerra Ventures The recent announcement of Nokia’s $2.3 billion acquisition of Infinera marks a significant turning point in the optical networking industry. This merger is poised to create a powerful entity with enhanced scale and capabilities, particularly in the rapidly growing sectors of webscale and enterprise networking. In this fireside chat at the ECOC Market Focus, Dave Welch, CTO of Infinera, will join Michael Lebby, CEO of Lightwave Logic, and Jose Pozo, CTO of Optica, to discuss the strategic drivers behind this landmark merger and its anticipated impact on the industry. The conversation will delve into Infinera’s current and future innovations, including their cutting-edge work in optical networking and indium phosphide (InP)- enabled modules, which are set to play a critical role in advancing the company’s technology roadmap. This session offers a rare opportunity to hear directly from one of the industry’s key leaders about the synergies expected from the merger, the importance of up-scaling, and the future trends in optical networking that will shape the market. 16:00 – 16:50 Nokia and Infineon

14:40 – 14:55 Cisco CMIS – Is Plug-and-Play Possible? Speaker: Doug Cattarusa, Cisco

The Common Management Interface Specification (CMIS) provides a well-defined mechanism to initialize and manage optical and copper modules in a standard way, while still providing the capability to provide custom functionality. This commonality makes integration into different host platforms easier for both the host and module vendors. The criticality of CMIS adoption continues to expand as higher-speed systems require more complex modules demanding more sophisticated management interfaces. This expansion also complicates the path forward. This presentation will explore the problem statement, the challenges of module plug and play, CMIS applications and benefits, and the steps toward widescale CMIS adoption. 15:00 – 15:15 TE Connectivity Impact of AI/ML Applications on Network Hardware Speaker: Nathan Tracy, TE Connectivity Artificial Intelligence and Machine Learning (AI/ML) has had a profound impact on content creation and the way work gets done, but what about it’s impact on hyperscale data center hardware? This presentation will discuss the profound impact that AI/ML has had on data center compute and networking interconnect hardware as well as some of the challenging performance levels required. From the perspective of data rates, performance levels, sheer numbers of interconnects, power levels, and different applications, the impact has been astounding. Consideration of future requirements will be discussed as well.

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