Monday Morning: Modules/Sub Systems 10:00 – 10:15 Lightwave Logic Inc
10:40 – 10:55 fibeReality, LLC Endurance of Optical Pluggables Through 200T Switches Speaker: Mark Lutkowitz, fibeReality, LLC The overwhelming desire of the hypersclalers is to remain with pluggables effectively forever. While it seems to be clear that with 100T switches, the marketplace will stay comfortably with these optical devices, anticipation of the next-generation architecture is necessary. NVIDIA’s AI platform designs are instructive in showing the way for providing sufficient space for pluggable transceivers, in a future design of a 200T switch. The possibility of 512x400G/lane versus 1024x200G/ lane will be examined (along with the feasibility of 32×6.4 terabit plugs). The latest insights on vertical line cards and thin-film lithium niobate as potential enablers will be discussed as well. 11:00 – 11:15 Cignal AI Datacenter Optics in the Age of AI – Market Overview and Update Speaker: Scott Wilkinson, Cignal AI Datacenter optics growth rates have exploded as AI requires exponentially more connectivity and bandwidth. In this presentation, we track the unprecedented rise in datacenter optics shipments and forecast growth for the future based on hyperscale capex, end-user demand, and supplier capacity. As 1.6TbE modules begin shipping in volume, what does the future look like for 800GbE? Explosive growth cannot continue indefinitely, so when will growth in spending slow? What optics reaches and technologies will be required for next generation datacenters? Does the bandwidth growth inside the datacenter translate to bandwidth growth outside the datacenter, and will it drive Telecom growth? 11:20 – 11:35 Intel Optical Compute Interconnect: Integrated photonics AI infrastructure scaling will require very significant increases in bandwidth density, energy efficiency, and reach, which optical connectivity based on a new type of integrated photonics is well positioned to support. Optical Compute Interconnect (OCI) chiplets co- packaged with a CPU/GPU or other SOCs provide a compelling solution and support a roadmap for the decade ahead. The talk will describe our current views on the most optimized integration approaches and their implications on reliability, manufacturability, and performance scaling. 11:40 – 11:55 Source Photonics The opportunity and design challenges of 200G/lane based 1.6T optical transceivers to meet demands of AI clusters Speaker: Frank Chang, Source Photonics With the outbreak of large AI models and computing power requirements, the market demand for optical transceiver modules, especially high-end module products, is rapidly soaring. The market penetration of 100G per lane supports the growing demand for 400G and 800G connectivity in enabling the AI wave sparked by ChatGPT. We anticipate 2024 is the year of 800G optical transceivers, while 1.6T transceivers represent the near future, and will start dominating the market from beginning of 2026 by leveraging the 200G per lane. The networking industry has established 1.6T optical transceivers using DR8, 2xFR4 and even LR8 scenarios to cover intra-DC links of up to 10km in either OSFP or QSFP-DD packages. In this talk, we will investigate how to apply these well-established 4/8- lane optical packaging for emerging 800Gb/s (based on 4x200G) and 1.6Tb/s (based on 8x200G) applications. The opportunities and design challenges of 200G/lane based 1.6T optical transceivers will be discussed in great details towards its commercialization. for AI infrastructure scaling Speaker: Christian Urricariet, Intel
World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators Speaker: Michael Lebby, Lightwave Logic Inc Electro-optic (EO) polymer modulators are a hot topic in the industry today as the industry strives to increase modulation speed while reducing optical network equipment power consumption, driven by G-AI needs to upgrade hypescaler datacenters. Polymer modulators are now showing world class performance for 200Gbps PAM4 lanes, with initial results at 400Gbps PAM4 lanes and headroom for 800Gbps lanes as polymers have significant bandwidth capability. This enables not only 4 channel by 200Gbps PAM4 lanes for 800Gbps pluggable transceivers today, but also 4 channel by 400Gbps PAM4 lanes for 1.6Tbps pluggable transceivers soon. Further, polymer modulators have the capability for 4 channel by 800Gbps PAM4 lanes for 3.2Tbps pluggable transceivers using 800G lanes as part of a technology roadmap plan. Recent world class EO polymers results include: 1) Clean PAM4 eye diagrams at 200Gbps with less than 1V drive voltage. 2) Super high bandwidth polymer based plasmonic devices that exceed 250GHz (EO S21 3dB) for 400Gbps PAM4 lane applications for4 channel by 400Gbps PAM4 (1.6Tbps) pluggable transceivers. 3) Very low voltage drive of ~0.5V (which allows direct drive from ICs, DSPs etc., and potentially can eliminate driver chips) 4) Very small footprint and size, which allows simple integration with PICs to turbo-boost silicon photonics. Tiny optical engines are ideal for pluggable and onboard-optic transceiver form-factors. 5) Commercial silicon foundry 200mm wafers where EO polymers have been easily integrated using standard PDKs. The talk will discuss the latest world class results with commercial grade electro- optic polymer materials that are being licensed for device applications for datacom at 1310 and 1550nm. These devices are fabricated onto 200mm silicon commercial foundry wafers and perform to 200G lane specifications at drive voltages less than 1V (which supports the drive to lower power consumption). Packaged polymer modulators will show the latest reliability and lifetime performance for datacenter applications. Reliability and stability results will be presented to show the robustness of the technology platform with respect to thermal stability and photostability in testing on materials, packages, and boards. Plans for CSP (Chip Scale Packaging) for polymer PICs will be shown based on dielectric sealants such as Atomic Layer Deposition at temperatures suitable for organic, polymer material. The talk will also show how the performance of EO polymer modulators can extend to not only 800Gbps and 1.6Tbps transceivers, but also 3.2Tbps, 6.4Tbps and beyond using the natural bandwidth characteristics of Perkinamine® chromophore organic material family. With EO bandwidths that exceed 250GHz that have been demonstrated with Polariton, single line or lane data rates that exceed 800Gbps PAM4 possible which opens a path for multi-Tbps data rate pluggable transceiver designs that include 3.2Tbps and 6.4Tbps for an exciting technology roadmap using polymer materials. 10:20 – 10:35 OpenLight Photonics The advantages of heterogeneous integrated The explosion of AI/ML applications drives next generation network architectures to handle high bandwidth, high density, low power interconnects. At 800Gb the industry supply chain has struggled to provide the demand required using conventional manufacturing processes and equipment. This has further validated the need for higher levels of integration at silicon scale. We present the next phase of integration combining III-V active devices and passive silicon photonic circuits available in a Process Design Kit (PDK) at a commercial foundry. We will show results from our latest 1.6TB (8x200G) photonic integrated circuit utilizing our 200Gb electro absorption modulators. photonic circuits for AI/ML applications Speaker: Adam Carter, OpenLight Photonics
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