ECOC Exhibition 2024 Show Guide

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Monday Afternoon: Topic: Modules/Sub systems 13:00 – 13:15 Cisco Optics for AI/ML Architectures Speaker: Mark Nowell, Cisco

12:00 – 12:15 Coherent Corp. Latest Status, Analysis and Specifications for Half- Retimed Pluggable Optics Speaker: Chris Cole, Coherent Corp. A major development in optical datacom has been Linear Pluggable Optics (LPO) promising cost, power, and latency savings by eliminating DSPs from modules. OFC 2024 had multiple LPO presentations and booth exhibits. Parallel major development was the approval by the OIF at the Jan’24 meeting, of Retimed Tx Linear Rx (RTLR) project, which promises robust, fully interoperable optical and electrical pluggable module interfaces at reduced cost and power. The first draft is under review, with potential 100G/lane baseline adoption in Aug’24. This presentation will give the latest RTLR status, analysis and specifications, compare linear and half-retimed optics, and discuss schedule. 12:20 – 12:35 NewPhotonics PICs Built for Interop: Consistent Link Performance Today’s scaling challenges of optical interconnect offset the advantages of OSP in AI workload processing on data center infrastructure. The introduction of next-generation integrated photonic interconnect solutions deliver performance improvements in latency and power reduction, but a more pressing demand must still be met: multi-vendor interoperability. This presentation from NewPhotonics will show how the introduction of equalizer technology in the optical domain in both optical transceiver modules provide the link-consistent performance required for effective multi-vendor interoperability enabled by all optics signal processing. This PIC breakthrough ensures extended value for data center infrastructure investment in both performance and optimized TCO. 12:40 – 12:55 Pilot Photonics Navigating Optical Parallelism: Comb Lasers or Laser Arrays for Next-Generation Interconnects Speaker: Frank Smyth, Pilot Photonics With SERDES speed increases becoming increasingly challenging to achieve, greater levels of optical parallelism will be required to continue to grow interface rates. Comb lasers and laser arrays are two alternative light source approaches for this highly parallel future. In this talk we discuss the pros and cons of each and to which market application (transport, cloud datacentre, AI/Ml, etc) and interconnect approach (pluggables, co-packaged optics, optical I/O) each is best suited. with Integrated Optical Equalizer Speaker: Yosef Ben Ezra, NewPhotonics

Building networks to address the AI/ML workloads creates new and additional challenges for the optical module industry to enable optimized solutions. This presentation will cover many of the leading approaches that are being considered such as higher speed optics, higher speed ports, lower power and denser solutions and the consequent system design challenges. Learn how these solutions can potentially address escalating power and cost concerns associated with higher speeds.

13:20 -13:35 OIF Coherent Optics in the Datacenter Speaker: Karl Gass, OIF

OIF’s 400G coherent specification (400ZR) been a resounding success for interoperability. It’s time to provide an update on our next two generations of coherent specifications (800ZR, 800LR, 1600ZR, and 1600ZR+). We will provide an update on 800ZR and 800LR technical work as well as an early status on 1600ZR and ZR+, reviewing trade- offs in optical system performance, latency, and power, and innovations. These projects will create the next core network architecture based on coherent pluggable technology common in next generation Cloud DCI and Telecom edge network interconnects. 13:40 – 13:55 MaxLinear, Inc. Low-Power Interconnects for Next Generation Networks Speaker: Drew Guckenberger, MaxLinear, Inc. The massive scale of next generation AI and datacenter networks is driving a significant focus on interconnect power reduction. This is absolutely required to successfully build out networks at the scale these applications require. Multiple technologies are competing to provide the right power/performance/reach trade-offs throughout these networks, including DAC/ACC/AEC/LPO/LRO/fully retimed optics. In this presentation, the network requirements for interconnect power at each network tier will be discussed, the technology options to meet these requirements will be reviewed and the performance trade-offs associated with each will be explored; attempting to identify potential winners and losers across these next generation networks. 14:00 – 14:15 Ciena Novel coherent technology implementation approaches with 3nm-based 800Gb/s pluggables and As the industry strives to deliver tangible efficiency improvements in network scale, cost per bit and energy reduction, innovative technology approaches are required. This session describes new networking opportunities resulting from the use of 3nm CMOS-based design implementations for both 200GBaud 1.6Tb/s performance-optimized transceivers as well as 140GBaud 800Gb/s QSFP-DD800 and OSFP transceivers. 1.6Tb/s performance Speaker: Bilal Riaz, Ciena

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