Monday Afternoon continued: Topic: Modules/Sub systems 14:20 – 14:35 vario-optics PCB embedded waveguide based optical compute interconnects for ML & HPC applications Speaker: Nikolaus Flöry, vario-optics The expanding AI-driven market fuels the development of next-gen switch-to-server and GPU-to-GPU connectivity solutions in machine learning (ML) and high-performance computing (HPC) applications. Optical interconnects are prime candidates due to their ability to increase I/O speeds and lane densities within systems with tight size constraints. In this talk we present the realization of complete on-board end-to-end optical compute interconnects, based on PCB embedded optical waveguides with vertically coupled optical light engines. The system enables 100G low power on-board communication rendering it ideal for operation in standard protocols such as PCI Express.
15:20 – 15:35 Futurewei Technologies Next generation of fiber access
Speaker: Frank Effenberger, Futurewei Technologies PON systems are continuing to evolve to meet the requirements of new and existing applications. ITU-T SG15 is conducting a study on very high speed PON systems, which are expected to be the follow-on system to the 50 Gb/s High speed PON system. The VHSP study is considering all manner of issues, including the viability of IM-DD, the availability of optical spectrum, the maturity of coherent PONs, and even the suitability of distributed fiber optical sensing. This talk with give an overview and outlook on this project. 15:40 – 15:55 Adtran Technologies for enabling the coherent edge Speaker: Joerg-Peter Elbers, Adtran Fiber broadband pushes coherent transmission towards the network edge. This talk discusses network requirements and how open networking solutions can address these requirements in an energy- efficient and intelligent way. Interview – Nokia and Infineon – merger of two giants in our field – exploring the impact, trends and opportunities for the industry. Speakers: Jose Pozo, Optica; Michael Lebby, Lightwave Logic; David Welch, NosTerra Ventures The recent announcement of Nokia’s $2.3 billion acquisition of Infinera marks a significant turning point in the optical networking industry. This merger is poised to create a powerful entity with enhanced scale and capabilities, particularly in the rapidly growing sectors of webscale and enterprise networking. In this fireside chat at the ECOC Market Focus, Dave Welch, CTO of Infinera, will join Michael Lebby, CEO of Lightwave Logic, and Jose Pozo, CTO of Optica, to discuss the strategic drivers behind this landmark merger and its anticipated impact on the industry. The conversation will delve into Infinera’s current and future innovations, including their cutting-edge work in optical networking and indium phosphide (InP)- enabled modules, which are set to play a critical role in advancing the company’s technology roadmap. This session offers a rare opportunity to hear directly from one of the industry’s key leaders about the synergies expected from the merger, the importance of up-scaling, and the future trends in optical networking that will shape the market. 16:00 – 16:50 Nokia and Infineon
14:40 – 14:55 Cisco CMIS – Is Plug-and-Play Possible? Speaker: Doug Cattarusa, Cisco
The Common Management Interface Specification (CMIS) provides a well-defined mechanism to initialize and manage optical and copper modules in a standard way, while still providing the capability to provide custom functionality. This commonality makes integration into different host platforms easier for both the host and module vendors. The criticality of CMIS adoption continues to expand as higher-speed systems require more complex modules demanding more sophisticated management interfaces. This expansion also complicates the path forward. This presentation will explore the problem statement, the challenges of module plug and play, CMIS applications and benefits, and the steps toward widescale CMIS adoption. 15:00 – 15:15 TE Connectivity Impact of AI/ML Applications on Network Hardware Speaker: Nathan Tracy, TE Connectivity Artificial Intelligence and Machine Learning (AI/ML) has had a profound impact on content creation and the way work gets done, but what about it’s impact on hyperscale data center hardware? This presentation will discuss the profound impact that AI/ML has had on data center compute and networking interconnect hardware as well as some of the challenging performance levels required. From the perspective of data rates, performance levels, sheer numbers of interconnects, power levels, and different applications, the impact has been astounding. Consideration of future requirements will be discussed as well.
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