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Tuesday Morning Topic: Components/IC/PIC/Fiber
10:00- 10:15 Coherent Corp Advances in Optical Components for Datacom and Telecom Transceivers Speaker: Julie Eng, Coherent Corp This talk will review advances in different types of technological platforms to enable next generation transmission. GaAs Vertical Cavity Surface Emitting Lasers (VCSELs), InP devices such as Electro-Absorption Modulated Lasers (EMLs) and Photonic Integrated Circuits, as well as Silicon Photonic devices will be reviewed in terms of challenges, new solutions and opportunities to support both Datacom and Telecom Transceivers.
11:00 – 11:15 IQE Plc
Quantum dot lasers at 300 mm for silicon photonics and datacentre optical interconnect applications Speaker: Ben Stevens, IQE Plc We will present data from a high volume QDL manufacturing platform that can meet the multiple demands of substrate form factor, substrate material and upstream QDL process flow needed for a variety of end users and applications. This will include results for multi-wafer 150mm GaAs based epi where an in-wafer variation < 0.25% at 1290 nm is typical. A p-down version can also be produced which enables flip chip bonding of III-V materials to Si photonic platforms. In this scenario the wafers have a similar wavelength uniformity an additionally an RMS <0.5 nm. Fabrication results support end user design optimization. For 300mm PICs the QD epi step is done after complex Si processing with limited scope for in-situ process monitoring. The key process is then the offset relative to the GaAs based process. In addition, any III-V on silicon process must also incorporate 1-2 um of material specific to nucleation and dislocation control. Data will be presented that shows successful outcome of process engineering which positions a QD region within 80nm of the waveguide after 3um of epitaxy. The third opportunity supported by the high-volume platform is QDLs on Ge. Whilst this is another path to 300mm it is best suited as a cost effective 200mm solution. Moreover, Ge substrates are CMOS compatible. Data will show similar PL characteristics to material grown on GaAs. 11:20 – 11:35 OIF Energy Efficient Interfaces for the Next Generation of AI Compute: Speaker: Jeff Hutchins, OIF The rapid evolution of artificial intelligence (AI) is driving larger and highly interconnected clusters along with the need to shuffle huge quantities of data between compute elements. The next generation of AI systems will need cost effective, low latency, dense, and energy efficient electrical and optical interconnections between the compute elements to facilitate these data transfers. The OIF’s Energy Efficient Interfaces group is helping to realize these advances through its pathfinding work and the development of standards to build the industry’s eco-system. Join this session to learn the latest on the OIF’s work on Energy Efficient Interfaces for AI compute. 11:40 – 11:55 Alfalume Inc Market perspectives of O-band GaAs Quantum Dot devices Speaker: Alexey Kovsh, CEO Alfalume Inc After several decades of research and development, the O-band GaAs Quantum Dot platform is poised to compete with InP technology across various applications, including Cloud Networking and AI-driven connectivity solutions, LiDARs and Free-Space Optical communications. This presentation will showcase the predicted advantages of Quantum Dots (QDs) in a production setting.
10:20 – 10:35 Vanguard Automation
Next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding (PWB) and
Facet-Attached Micro-Optical Elements Speaker: Sebastian Skacel, Vanguard Automation
Photonic wire bonding allows to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment. 3D nano-printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.
10:40 – 10:55 Nokia Shanghai Bell
Is there any room for new oDSP vendor? Speaker: Mingyang Lyu, Nokia Shanghai Bell
With the well-known acquisition of Inphi and Acacia, the DSP market for optical communications has become characterized by oligopoly competition. However, due to geopolitical and supply chain issues, there is a global shift towards assessing the local supply capabilities of products. In this context, taking the Chinese market as an example, an analysis of the commercial feasibility of new DSP suppliers has been conducted based on the R&D process and investment in DSP chips, combined with the overall market scale and forecasts.
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