Wednesday Morning Topic: Networking/Systems/ Service Provider
10:00 – 10:15 DustPhotonics Silicon Photonics operating at 1.6 Tbps in an Immersion Cooling Environment Speaker: Ronnen Lovinger, DustPhotonics
11:20 – 11:35 iPronics Optical networking engines for next generation of AI architectures Speaker: Ana Gonzalez, iPronics The explosion of AI applications demands ever-more powerful AI clusters. However, electronic switches are reaching their scalability limits. AI clusters require faster reconfiguration, increased flexibility, lower power consumption, and reduced cost per port. Programmable photonics offers a solution, the technology presented here can reconfigure in microseconds or even nanoseconds, adapt to any switching strategy through software control, can incorporate channel processing and achieve significant power and cost reductions per port. This presentation explores how optical switches based on programmable silicon photonics can represent a game changer in up-scale and out-scale configurations in the next generation of AI architectures.
As data rates increase, networks are increasingly burdened with significant thermal challenges, including the challenges that arise from the heat-load associated with high-speed optics. Dust Photonics has developed high speed silicon photonics components that are capable of operating at 200G/lane while supporting immersion cooling. Specifically, these components embed off-the shelf lasers inside the PIC. This combined with a direct-attach process for coupling the fiber to the PIC allow transceivers to be designed without any free-space gaps, which is a key requirement for immersion cooling application. This talk will discuss the work that has been done to achieve this result.
10:20 – 10:35 Broadcom Inc. Will You Need CPO In 3 Years? Speaker: Rajiv Pancholy, Broadcom Inc.
11:40 – 11:55 Marvell Data Center Interconnects in the Era of AI Speaker: Loi Nguyen, Marvell
AI/ML cluster sizes are growing exponentially, making optics essential to interconnect tens of thousands of GPUs. Bandwidth, power, latency, and cost demands expected in five years are now required much sooner. Additionally, folded CLOS, Dragonfly, and Torus interconnect architectures, supporting higher radix requirements, present challenges in density, fiber routing, and thermal management, all aimed at achieving the lowest cost per compute. At ECOC 2024, we plan to present the status of Broadcom’s Co-Packaged Optics technology platform, addressing the challenges for current and next-generation developments supporting both scale-up and scale-out interconnects. 10:40 – 10:55 Innolight Advanced Optical Connectivity Solutions for AI/ML applications Speaker: Rang-Chen Yu, Innolight AI/ML is driving optical connectivity solution speed upgrade at much faster pace at low power, low latency and lower cost. We will discuss up and coming optical connectivity solutions for AI/ML accelerated computing and networking applications to meet these challenging requirement, such as LPO, LRO, CPO, etc. with advanced integrated photonics circuits, and packaging technologies. 11:00 – 11:15 Lumentum Energy Efficient Optics for Sustainable Scaling of AI Networks Speaker: Brian Smith, Lumentum Data center hardware infrastructure is undergoing an unprecedented period of expansion, driven in large part by the rapidly growing computational demands of AI, with large and complex compute clusters consisting of tens of thousands of processing elements. This results in a significant, and potentially unsustainable increase in datacenter energy usage. This presentation will quantify power consumption scaling associated with large AI training cluster implementations and will highlight the potential of energy-efficient optical transceiver technology and optical circuit switching to improving network energy efficiency, delivering >80% network power reduction, and saving up to 10,000 metric tons of CO2 per training cycle.
Artificial intelligent (AI) is driving massive changes in cloud data centers. Privacy laws and sovereignty will require AI data centers to be within borders. More data centers also mean more coherent optics. Power will become the most important criteria. Pluggable optics are solution to reduce DCI interconnect power. Approximately 1 million DCI pluggable optics have been deployed in cloud metro networks. Next-gen 800G coherent optics will replace transponder boxes in cloud backbone networks. This trend will continue at 1.6T, which is under development today. Dr. Loi Nguyen will discuss the challenges and industry DCI optics roadmap for the AI era. 12:00 – 12:15 Omdia Connections in AI Networks Inside the Data Center Speaker: Lisa Huff, Omdia To support the AI revolution, the need for optical transceivers, active optical cables (AOCs), and active electrical cables (AECs) has already substantially increased. Data rates connecting XPUs have risen from 100G/200G just a year ago to 400G and 800G deployments today. This transition will continue throughout 2024 and into 2025 with several gating factors. The market for connection technologies inside the data center will be discussed along with these gating factors.
12:20 – 12:35 Panel Session: Linear Optics Comes of Age Karen Liu (Moderator) Nubis Communications – Samuel Kocsis Amphenol – Karl Muth Broadcom – Hacene Chaouch Arista – Tom Palkert Macom
Linear optics has matured and expanded. This panel seeks to give an update that spans these axes: electrical/optical, MSA/Std, vendor/user, Ethernet/CXL.
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