ECOC Exhibition 2024 Show Guide

Monday 23rd September 14:50 – 15:20 Samtec Redefining Data Center Topologies with Mid-Board Optical Transceivers Speaker: Matthew Burns, Samtec The ongoing disruption of generative AI, machine learning and disaggregated computing forces data center system architects to rethink next-gen computing topologies. Traditional server, storage and networking implementation are giving way to GPU clustering, cache coherency and extended reach cabling within the rack, rack-to-rack, and across the data center. Traditional copper interconnects have latency and distance limitations that limit scaling. Mid-board or on-board optical transceivers offer improved performance and form factor advantages while solving distance, latency, and bandwidth challenges. In this presentation, Matthew Burns will detail Samtec’s growing portfolio of mid-board optical transceivers. Additionally, he will discuss a real-world CXL® over optics demonstration featuring Samtec, Rambus and Viavi technology making remote cache coherency a reality. Lastly, he will update the latest performance capabilities of Samtec’s Halo™ Next-Gen Optical Transceivers. 15:30 – 16:00 Ligentec Integrating Active Components in Low-Loss Photonic Integrated Circuits (PICs) Speaker: Michael Geiselmann, Ligentec Low optical losses, extensive components list and maturity of the processes are very important for high-performance PICs in both conservative markets with well known approaches, as well as for emerging and disruptive applications. In this talk we will give an overview of the current state of LIGENTEC low loss platforms and discuss the integration of beyond state of the art photodetectors and modulators. This gives access to a heterogeneous offering of extremely low losses in combination with high bandwidth low loss photodetectors and modulators. 16:10 – 16:40 Scintil Augmented Silicon Photonics for demanding Data The computing and data needs of AI are growing faster than the core semiconductor technologies. Parallelism is necessary to address this challenge with optical interconnects penetrating deeper into data centers and HPC clusters to enable higher data throughput and lower power consumption. Although silicon photonics can provide the densest and most cost-effective solution, it cannot integrate lasers. During the presentation, I will describe SCINTIL’s technology for heterogeneous integration of III-V materials, leveraging foundry standard silicon photonics, to deliver PICs with integrated lasers and SOA. I’ll finish with the benefits of WDM PIC solutions to support terabit capacities with pluggable or co-packaged optics. Center and AI/ML network Speaker: Yannick Paillard, Scintil

Tuesday 24th September 10:00 11:30 Infinera - Open XR Forum The Open XR Forum Industry Update

This session provides an overview of the XR Optics management and transceivers specifications roadmap, an update on the latest Proof of Concepts (PoC), as well as an update on the Open XR Forum activities within the optical networking industry. 11:45 – 12:55 ECOC Exhibition Industry Awards Presentation 13:00 13:30 Chroma Germany Reliability Test Solutions for SiPh High-Variety Manufacturing. Speaker: Jeff Lee, VP of Sales & Marketing, Chroma Germany SiPh applied to Co-Packaged Optics (CPO) owes its existence to the potential for compactness, higher bandwidth, lower latency and higher signal integrity, making such newly emerging technology especially promising for future high-speed data communication applications such as network switching in Data Centers and data transfer between High Performance Computing processing units. To keep high-speed transfer accurately, stringent device/component reliability should be guaranteed to some level and this is what this emerging technology lacks as non- standardization attribute and initial-phase low-volume deployment rate accumulate few lab/field statistics to support device reliability assessment. Our ongoing efforts aim to invest our long-accumulated reliability test experience to fill such gap by leveraging our precision electrical sourcing/measuring technology and our stress environment control ability. Furthermore, we expect service offering in SiPh reliability test at vendor’s site to be a viable way to lower the CAPEX for fabless suppliers and low-volume R&D houses. Special Requirements for Optical Connectivity in AI Optical connectivity is a critical component of AI infrastructure. The exponential growth of AI data sets and model sizes, complex neural networks, and the need for real-time analytics demand highly efficient, fast, and reliable data transmission. We can embrace the power of high-speed optics to unleash the potentials of AI applications. To achieve higher bandwidth, we need to upgrade optical/electrical components and networks to higher rates, such as 200 Gbps/Lane, 400 Gbps/Lane, 1.6 Tbps, and 3.2 Tbps. When will these high-speed technologies be available? Which among silicon photonics, VCSELs, and TFLNs will lead the development of these technologies?How to cope with the power consumption and cost issues caused by the increase in the optical connectivity rate? The reliability of optical connectivity is absolutely important to the computing efficiency of the AI model. The solution to further optimizing the reliability of optical connectivity is one of the most important factors that determine the optimal solution of the next-generation optical connectivity. At this session, IPEC will discuss these issues with industry-leading experts. The optimal optical connectivity will bring infinite possibilities for AI applications. Agenda Moderator: Tom Issenhuth, Chair of IPEC PMD WG 13:40 – 14:40 Special Requirements for Optical Connectivity in AI Clusters 13:40 –13:45 Opening 13:45 –13:50 Wenyu Zhao IPEC & CAICT 13:50 – 13:55 Hideki Isono IPEC & Fujitsu Optical Components / IGS Consulting 13:55 – 14:05 Eric Bernier Huawei Technologies Canada Co., LTD. 14:05 – 14:15 Lu Liu CAICT 14:15 – 14:25 Jim Theodoras HG Genuine USA 14:25 – 14:40 Tiger Ninomiya Accelink Technologies Co., Ltd. 13:40 – 14:40 IPEC

OPEN XR

FORUM

OPEN XR