Hybrid Software Conducts Fusion Packaging Summit BY GREG KISHBAUGH
Flint Group Digital Xeikon Brings Back Innovation Days Flint Group Digital Xeikon has announced the return of Xeikon Innovation Days. The Euro- pean version will take place June 9-10, 2026, at Xeikon’s Global Innovation Center in Lier, Belgium. One week later, the North American
Hybrid Software, a provider of prepress and workflow solutions for the label and packaging industry, concluded its first Fusion Packaging Summit in the United States. The event brought together more than 170 partners, brands, customers, industry experts, and sponsors for three days of discussion on the future of packaging and print. The summit featured 27 sessions addressing key industry develop- ments, with customer-led presentations forming a central part of the program. These sessions highlighted real-world applications of Hybrid Software and partner solutions for brands and converters, demonstrat- ing measurable business impacts from design to printed packaging. Among the topics, discussions on Amazon Transparency and GS1 Sunrise attracted strong interest, underlining how traceability initia- tives and global standards are reshaping packaging requirements. A
edition will take place June 16-18, 2026, at the Chicago Innovation Center in Elgin, Illinois. Under the umbrella theme “Print. Smarter. Together.”, the event will bring together cus- tomers, prospects, and partners for a program of live demos, customer conversations, appli- cation showcases, and hands-on experiences designed to accelerate decision-making in digital label and packaging production. Xeikon Innovation Days 2026 will also serve as a visible expression of a broader transformation: Xeikon’s evolution into Flint Group Digital Xeikon, a core digital business within the newly rebranded Flint Group Pack- aging Solutions. The announcement follows Flint Group’s recent rebrand to Flint Group Packaging Solu- tions, reflecting the company’s focus on the global packaging sector and its commitment to delivering integrated, sustainable and fu- ture-ready solutions across inks, coatings, consumables, services and equipment. A list of industrial partners has signed up to exhibit during the events. They include CERM, Esko, Fedrigoni, Flexo Wash, GM, Her- ma, Hybrid Software, KURZ, Lake Image Sys- tems, Meech, Schober, Scribos, RBC, Wink, and Yupo.
case study from Diageo demonstrated how 2D and 3D rendering tech- nologies are enhancing decision-making, reducing the need for physi- cal prototyping, and accelerating time to market. Industry partners also used the event to announce two strategic collaborations: XSYS unveiled an expanded partnership with Hybrid Software, focused on delivering more fully integrated solutions for the FLAG Amazon Transparency and GS1 Sunrise were highlighted at the Fu- sion Packaging Summit 2026 in a presentation by Michael Manley, Senior Manager, Global Business Development at Amazon.
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