PRODUCT NEWS
Micro Assembly and Active Alignment Stations on OFC
During OFC Optical Fiber Conference in Los Angeles, nanosystec presents the NanoWelder on booth # 709. This high-precision active alignment and micro welding station assembles optoelectronic components in the sub-micron regime with minimum shift. The fast active alignment uses any feedback signal such as optical power, beam pointing or PER. A key feature is the accurate laser micro welding process. The NanoSeries stations use high-precision epoxy gluing and laser soldering or welding (or a combination of various joining methods). NanoTest performs optical and electrical characterization for Silicon Photonics Devices on wafer and
assembly techniques include gluing and UV curing, selective laser soldering and hot bar soldering, eutectic bonding and laser welding. According to the production volume, loading is performed manually or automated with robots, belts and feeders. All stations can be customized to perfectly reach the desired technical performance and throughput. Headquartered in Germany, nanosystec addresses customers worldwide with local support in North America and Asia. With nearly 30 years of experience, nanosystec offers a broad knowledge base to tailor the systems to the customer requirements.
chip level, VCSEL wafers, laser bars and CoS and High-Density PICs. The VersaSeries pick-and- place mounts opto-electronic assemblies and other precision
devices with a precision between 1 µm and 10 µm. Typical processes include the placement of laser structures, optics, apertures and similar components requiring high accuracy. The
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Powering the next generation of AI Datacenters with high-performance 400G photodiodes
At the upcoming OFC Exhibition 2026 in Los Angeles, Albis Optoelectronics will
manufacturing qualified InP and GaAs photodiodes. The extensive product range includes PIN photodiodes for various digital and analog receivers; high power photodiodes; low bias, high sensitivity APDs for 28 Gbaud PAM-4 and 100GBASE- ER4 applications; monitor photodiodes; photodiodes with integrated lenses; as well as hermetically packaged, short and long-wavelength microwave photodetectors up to 50 GHz. All products are manufactured in large volumes at our state-of- the-art clean-room facilities in Rüschlikon, Switzerland. Attendees of OFC Exhibition 2026 are invited to visit Albis Optoelectronics’ booth #1121 to discover how our photodiodes can elevate your optical communication systems to new heights.
showcase its latest edition of 400G photodiodes targeting next-generation optical transceivers that support high-end AI applications in cloud data centers. Our latest generation of InGaAs photodiodes combine superior bandwidth with unsurpassed responsivity, ensuring precise signal detection at 400G line rates in compact optical modules. Integrated backside lenses simplify optical coupling while improving alignment accuracy and overall coupling efficiency which is critical for dense co- packaged optics and high-port- count switches. Multiple pad configurations support flip-chip soldering, allowing seamless
integration with TIAs and advanced packaging platforms. Positioned for high-end AI clusters and hyperscale data centers, these new 400G InGaAs photodiodes aim to reduce power per bit and increase link margins, helping system builders keep pace
with rapidly growing bandwidth demands. Samples and reference designs are available to accelerate time-to-market for 400G optical modules. With over 20 years of experience, Albis Optoelectronics specializes in designing and
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ISSUE 43 | Q1 2026
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