• Items
Notice in Mounting
Diamond Micro Size (A.P.S.)
Nominal Dimensions (mm)
ADDMA No. ※ 1
Shape
Product No.
Diamond Diameter （ d ）
Diamond Thickness （ t ）
Grain Size
WD900
WD700
WD800
1
5
12
WD910
WD940
WD995
Tungsten Carbide
SumiDisk (High Density PCD)
Method for mounting
Brazing
Heat shrinking
D6 D12 D15 D18
RX55/ 1.0 RX55/ 1.5 RX55/ 2.5 RX55/ 3.5
F F F F
M M M M
C C C C
55.0 55.0 55.0 55.0
1.0 1.5 2.5 3.5
Less than 350 ℃ Interference of shrink fit: Less than 0.05mm
Less than 600 ℃
Less than 600 ℃
Less than 900 ℃
Mounting Temperature
Diamond
φ d
t
650 ℃
850 ℃～ 1000 ℃
650 ℃
650 ℃
Allowable temperature limit
・ Do not use brazing method when mounting the Die. ・ Uniform force should be applied to the cermet ring when mounting. ・ Choose mount method when using WD900 series.
Caution
• Notice in Processing
Precaution for mounting process
Powdered brazing alloy
• Die blanks should be placed at the center of SUS case. • Die blanks should be set parallel to the case. • Do not allow space between brazing alloy and blank. (It is effective to apply pressure during heating or immediately after heating.)
Cup
Die Blank
Case
Off-center
Incline
Void
Precaution for use about shrink t type (WD960, 970).
WD960, 970 type adopt original design which PCD is pressed into support ring after sintering to avoid horizontal crack while machining. PCD diameter is different each side. (about 3%)
Large PCD diameter side : marked A
PCD
Support ring
Small PCD diameter side : marked B
・ PCD is pressed into support ring in the direction from side A to side B. Please use as Side A is Bell side, and Side B is Exit side. ・ WD960, 970 can use re-insertion to support ring when PCD slip out. ・ PCD and support ring are not combined so please keep the radial thickness of PCD more than 1.0mm.
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