Board Converting News, May 31, 2021

IoPP Names Winners Of Packaging Education Scholarship Fund Each year, the Institute of Packaging Professionals (IoPP) awards over $10,000 in scholarships to students studying packaging or a related field. IoPP is proud to announce the recipients of our 2021 Scholarship opportunities. Cho- sen from a pool of qualified applicants are this year’s IoPP scholarship winners: • Grace Ellis, a packaging student at Michigan State Uni- versity (class of 2022) has been awarded the PepsiCo R&D Scholarship worth $5,000. • Anna Kent, a packaging student at University of Wiscon- sin – Stout (class of 2023), has been awarded one of the $2,500 IoPP Packaging Education Scholarships. • Seohee Jang, a packaging engineer technician student at Conestoga College (class of 2021), has been awarded

one of the $2,500 IoPP Packaging Education Scholarships. • Wallace Layman, a dual degree student studying Paper Science and Engineering and Chemical Engineering at North Carolina State University (class of 2023), has been awarded the $1,000 IoPP Packaging Education Scholar- ship, sponsored by IoPP’s Central Ohio Chapter. • Haliah Offutt, a graphic communications major at Illinois State University (class of 2022), has been awarded the $500 IoPP Packaging Education Scholarship, sponsored by IoPP’s New England Chapter. “Now more than ever it is important to invest in the fu- ture of the packaging industry,” said Jane Chase, exec- utive director, IoPP. “Not only will this year’s scholarship rewards aid these deserving students in their studies, our scholarship programs also provides them with heightened visibility within the industry, ensuring strong candidates for the future packaging workforce.” More information about this year’s scholarship winners can

be found online. Special thanks to the judges who volunteered their time to select the win- ners of these prestigious scholarships: • Ali Ali – Siemens • Andy Busteed – 3M • Doug Compton, CPP – Owens Corning • Matt Culver, CPP – Target Corp. • Suzanne Fenton, CPPL, Fellow – Spartech • Susan Gruskin, CPP – PepsiCo • Molly Lynn, CPP – Russell Stover Choco- lates • Rebecca Oesterle, CPPL, Fellow – IoPP Board Chair • Jo Ann Ratto – U.S. Army DEVCOM Sol- dier Center • Amy Schupbach, CPPL – Fresenius Kabi • Amy Stewart - Printpack Those interested in applying for an IoPP Scholarship opportunity in 2022 can find an application and more information on- line now. Learn more about IoPP by visiting www.iopp.org . Pack Print International To Be Held In 2022 The next edition of PACK PRINT INTERNA- TIONAL, International Packaging and Print- ing Exhibition for Asia, will be postponed until February 9–12, 2022, at BITEC in Bangkok, Thailand. The move to next year from the original September 2021 dates will allow for optimum international partici- pation. At the last staging in 2019, interna- tional exhibitors accounted for about 60 percent of the 325 participating companies and the more than 19,000 visitors came from 62 countries.

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May 31, 2021

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