FMN | April 26th, 2021

Cloud Freedom (Cont’d from Page 11)

Industry Events

production standards across jobs, printing equipment, shifts and even sites. The cloud-based platform integrates with Esko Au- tomation Engine and AVT Helios automated inline in- spection solutions for label and narrow web printing. Platemaking Partnership Additionally, Esko and Asahi Photoproducts have showcased their fully automated flexo platemaking line CrystalCleanConnect at this year’s virtual.drupa event. Esko, the global developer of integrated software and hardware solutions for the packaging and labels markets, has collaborated with Asahi Photoproducts, developers of flexographic photopolymer plates, on the flexo platemaking solution. CrystalCleanConnect reportedly fully automates the entire platemaking process, from imaging and exposure through to plate production, reducing the number of steps in the flexo platemaking process from 12 to just one.This equates to a reduction from 36 minutes in platemaking and plate cutting to just 2.5 minutes of operator time to complete all processing steps. Gift Of Education In further news, Indiana State University received a multi-million-dollar in-kind gift of package engineer- ing technology software from Esko, a global developer of integrated software and hardware solutions for the packaging industry. This partnership continues the company’s two decades of support for the program. For the next three years, Esko will provide 50 soft- ware licenses to industry-leading programs. The part- nership will keep ISU students educated on the latest technology and promote a skilled workforce for Esko customers. ISU’s program has a 100 percent place- ment rate into jobs after graduation. The partnership with ISU doubles the number of stu- dents who have access to the same software used to develop nine out of 10 retail packages. Expansion of the partnership includes a cloud-based version of Esko software,which allows students to work on classroom projects in a remote setting. In addition, the College of Technology Packaging Engineering Lab is equipped with the software, allowing students to seamlessly transition projects to the production stage.

FTA InfoFlex 2021 (Virtual) May 3-4, 2021 Kansas City, MO

SuperCorrExpo 2021 August 8–12, 2021 Orange County Convention Center Orlando, FL

Labelexpo Europe September 21-24, 2021 Brussels Expo Brussels, Belgium

CorrExpo 2021 September 27 - 29, 2021 St. Louis, Missouri

FTA Fall Conference October 4-6, 2021 Frisco, TX

Label Congress 2021 September 29-October 1, 2021 Brussels Centre Expo Brussels, Belgium TLMI Annual Meeting October 17-19, 2021 Naples Grande Beach Resort Naples, FL

Labelexpo Europe April 26-29, 2022 Brussels Centre Expo Brussels, Belgium

Oliver Inc. Acquires Boutwell Packaging

Labelexpo Americas September 13-15, 2022 Donald E. Stephens Convention Center Rosemont, IL

Oliver Inc. acquired Boutwell Packaging, a manufac- turer of folding carton packaging serving personal care, healthcare, and food and beverage markets.

Flexo Market News April 26, 2021 13

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