Amphenol Socapex │ USBFIELD™ | USB3.2
µCom-USB3.2 & TVµCom-USB3.2
DESCRIPTION
These specific adaptations of µCom and TVµCom are optimized for USB3.2 Gen1 and intended for connec - tion and disconnection in harsh environment military and aerospace applications.
MAIN FEATURES
DATA TRANSMISSION: - USB specification 3.2 Gen1. - Data rate up to 5Gb/s for high speed USB - Hot pluging: enables connection and disconnection while the system is running. - 4 pairs totally insulated throughout the connector: minimum cross- talk between pairs. - Patented special interfacial shapes: minimum perturbation at the interface of each pair. µCOM: - Environmental testing based on MIL-DTL-38999 series III military specifications (Thread version). - Environmental testing based on MIL-DTL-26482 military specifications (Push-pull version). - Miniature: 15 mm (.59˝) max external diameter. - Receptacle and in-line receptacle compatible with both Thread and Push-pull plugs. - Machined brass shells - Salt spray: - 500 h with Unplated brass shell - 500 h with Olive Drab Cadmium plating - 500 h with Black Nickel plating
TVµCOM: - Based on MIL-DTL-38999 series III – Shell size 11 - Aluminium shells - Salt spray: - 48 h with Nickel plating - 500 h with Olive Drab Cadmium plating - 500 h with Black Zinc Nickel plating - 500 h with Tin-zinc plating - 1000 h with Marine Bronze shell - 500 h with Passivated Stainless steel shell - Solder contact: max AWG24 - Crimp contact: AWG 24 to 28 - Temperature range: - 55°C / + 125°C - IP68 sealing mated and unmated for PCB receptacles - 1500 Vrms Dielectric Withstanding Voltage
HOW TO ORDER : PLEASE REFER TO PAGE 119 & 120
www.amphenol-socapex.com Due to technical modifications, all information provided is subject to change without prior notice Designed by Amphenol Socapex
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