Amphenol Socapex | USBFIELD™ | USB3.2
µCom-USB3.2 & TVµCom-USB3.2
These specific adaptations of µCom and TVµCom are optimized for USB3.2 Gen1 and intended for connection and disconnection in harsh environment military and aerospace applications. Main Features Description
Data Transmission: •
USB specification 3.2 Gen1.
Data rate up to 5Gb/s for high speed USB
•
• Hot pluging: enables connection and disconnection while the system is running. • 4 pairs totally insulated throughout the connector: minimum cross-talk between pairs. • Patented special interfacial shapes: minimum perturbation at the interface of each pair.
µCom: • Environmental testing based on MIL-DTL-38999 series III military specifications (Thread version). • Environmental testing based on MIL-DTL-26482 military specifications (Push-pull version). • Miniature: 15 mm (.59˝) max external diameter. • Receptacle and in-line receptacle compatible with both Thread and Push-pull plugs. • Machined brass shells • Salt spray: • 500 h with Unplated brass shell • 500 h with Olive Drab Cadmium plating • 500 h with Black Nickel plating
: RoHS compliant
TVµCom: • Based on MIL-DTL-38999 series III – Shell size 11 • Aluminium shells • Salt spray: • 48 h with Nickel plating • 500 h with Olive Drab Cadmium plating • 500 h with Black Zinc Nickel plating • 500 h with Tin-zinc plating • 1000 h with Marine Bronze shell • 500 h with Passivated Stainless steel shell
• Solder contact: max AWG24 • Crimp contact: AWG 24 to 28 •
Temperature range: - 55°C / + 125°C
• IP68 sealing mated and unmated for PCB receptacles • 1500 Vrms Dielectric Withstanding Voltage
: RoHS compliant
How to order : Please refer to page 119 & 120
Amphenol SOCAPEX
Due to technical modifications, all information provided is subject to change without prior notice Designed by Amphenol Socapex
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