PRODUCT NEWS
EXFO’S LTS-1600 Series - Engineered for what’s next
Engineered for what’s next, the LTS-1600 Series gives labs, manufacturers, and hyperscalers a scalable platform for validating 1.6T Ethernet, coherent optics, transceivers, cables, and systems—while preparing confidently for the evolution toward 3.2T. Built as a purpose-designed 1.6TE test platform, it combines full-capacity Ethernet testing, industry compliance workflows, and advanced performance analysis in one system. Validate auto-negotiation and link training, perform BER testing and BLER monitoring, generate layer 2 traffic, and analyze 200G lanes at 224G SerDes across transport, switching, ASIC, and optical module applications. Four independent coherent ports operate as separate test engines, enabling teams to
configure different line rates, modulation formats, FEC settings, and wavelengths for parallel testing. Support for 2×800G, 4×400G, and 8×200G breakouts helps validate lane performance, signal integrity, and FEC behavior under real deployment conditions. A live, unrecorded setup mode lets engineers fine- tune parameters and confirm behavior before recording a formal test run and generating trusted reports. Flexible OSFP and OSFP-RHS
configurations, scalable one-, two-, or four-port options, and dual-port cable testing help teams adapt capacity to changing requirements without overcommitting upfront. The web-based GUI supports advanced R&D and manufacturing workflows with customizable screens, saved layouts, and broad transceiver control. Its modular architecture gives teams the flexibility to expand capacity as programs grow and support new validation scenarios, while helping protect
investments as higher-speed interfaces advance toward production environments. Together, these capabilities help teams test more devices in parallel, reduce setup changes, accelerate repeatable validation, and create a simpler path to trusted AI infrastructure. Learn more: www.exfo.com/en/products/lab- manufacturing-testing/network- protocol-testing/lts-1600-series
Visit EXFO at ECOC booth 2198
Foundry-Ready Photonic PDK Enables Design of 200G and 400G Silicon-Organic Hybrid Modulators
Lightwave Logic has announced the availability of its foundry-ready photonic process design kit (PDK) for silicon-organic hybrid (SOH) modulators, enabling photonic integrated circuit (PIC) designers to incorporate high-speed electro-optic polymer modulators into next-generation silicon photonics designs. Developed to support emerging 200G and 400G-per- lane optical interconnects, the photonic PDK provides parameterized building blocks for key SOH device elements, including slot waveguides, mode converters, phase shifters and Mach–Zehnder modulators. Integrated into established silicon photonics design environments, the PDK allows engineers to evaluate and optimize advanced modulator architectures using familiar workflows while maintaining compatibility with commercial
silicon photonics foundry processes. Customers can now engage with Lightwave Logic to incorporate silicon-organic hybrid modulators into upcoming multi-project wafer (MPW) and dedicated tape-outs using these foundry- ready photonic PDKs. Recent demonstrations in Luceda’s IPKISS design environment, together
with the availability of device libraries through the GDSFactory ecosystem, illustrate how electro-optic polymer modulators are becoming accessible across multiple photonic design environments and foundry platforms. By combining mature silicon photonics manufacturing with high-performance electro- optic polymers, Lightwave Logic is helping enable the
next generation of optical interconnects for AI, cloud and high-performance computing applications. The availability of foundry-ready photonic PDKs lowers the barrier to adoption by allowing designers to integrate silicon-organic hybrid
modulators into custom PICs using the same design flows and manufacturing ecosystems they already rely on for production silicon photonics.
Learn more: Visit www.lightwavelogic.com
www.opticalconnectionsnews.com
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ISSUE 44 | Q3 2026
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