A D V A N C I N G MICROELECTRONICS
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This is an exciting time for the IC packaging industry. Innovation in these critical areas marches on, with the ulti- mate goal of enabling new solutions and applications that make our world smarter, more efficient, and, and overall better place to live, work and play.
Thermal Conductivity & Electrical Insulation UNDERFILL EPOXY o ers
Low viscosity system EP29LPTCHT with convenient handling
EXCELLENT FLOW Mixed viscosity 5,000-15,000 cps
ELECTRICAL INSULATION, 75°F Volume resistivity >10 15 ohm-cm LONG WORKING LIFE 10-12 hours 100 gram batch at 75°F
THERMAL CONDUCTIVITY 9-10 BTU•in/(ft•hr•°F) [1.30-1.44 w/m•K]
www.masterbond.com 154 Hobart Street, Hackensack, NJ 07601 USA • +1.201.343.8983 • mainmasterbond.com
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