Amphenol Socapex │ PCB CONNECTORS
QUICK SELECTION GUIDE
Standard / Approval
HDAS
SMASH
HDB 3 /HSB 3
R-VPX
R-SATA
127/HE8
M55302/140 to /155
MIL-DTL-55302
NFC UTE 93424/ HE801-804-807
NFC-UTE
SATA 3.0
SATA VITA
VITA 46
Not available for SMT version
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RoHS
Board configuration Motherboard to daughterboard
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Mezzanine
Stacker
Test only
Test only
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Board to cable Extender / PC
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Contact termination Press fit / compliant
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Thru hole soldering
Surface mount
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Crimping Solder cup
Test only
Test only
Contact technology Starclip 6-tines
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Brush
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Stamped and formed Micro-hyperboloïd
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Upon request
Lateral displacement compatible Technical features / accessories Guiding devices
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Polarization keys / keying
Locking system Rackable solution Arrangements Signal Differential pair
Upon request
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Power Coaxial Optical
Upon request Upon request
Pitch / contact pattern Staggered grid
1,905 [.075] 0,9525 [.0375] offset
1,72 x 1,52 [.070x.060]
2,54 [.100] 1,27 [.050] offset
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1,8 x 1,8 [.039x.039]
Square grid
1,905 [.075] 0,635 [.025] offset
Chevron grid
Contacts number 1 row
7
Under development
22
17 to 96 80, 144
2 rows 3 rows 4 rows 5 rows
50, 77, 119, 152
102, 202
154
40, 60, 80, 120, 160
253
132, 150, 264, 300, 396, 450
6 rows
8 or 16 columns 3U or 6U
Other
Electrical Current rating per contacts (A) Dielectric Withstanding Voltage (Vrms)
4,5
3
2
1,5
3
750
1000
750
1000
4
6,25
10
6,25
Not applicable
Max data rate (Gbps)
Mechanical Electrical security / Backoff Mating / Unmating force (g)
1,2mm [.047 in]
1,2mm [.047 in]
1 mm [.039in]
95
95
45
180 500
500
500
100 000
500
20 000
Durability
Environmental Salt spray (hours)
96
96
48
48
96
-65 / +150
-65 / +150
-65 / +125
-55 / +105
-55 / +125
Temperature range (°C) Material / plating Active area (gold thickness)
1µm [.039µin]
1.3µm [.051µin]
1.3µm or 0,5µm [.050µin or .020µin] Tin-lead, pure tin or gold
1.3µm or 0,75µm [.050µin or .030µin]
1µm [.039µin]
Tin lead, bright pure tin, mat tin, gold, Silver-tin
Tin lead, lead free or gold
Tin-lead or lead free Gold or tin lead dip Tin-lead or lead free
Termination area
Brass alloy
Brass alloy
Beryllium copper
Copper alloy
CuSn9P or CuZn
Contact
LCP thermoplastic LCP thermoplastic LCP thermoplastic LCP thermoplastic
DAP thermoset
Housing
Amphenol SOCAPEX
Due to technical progress, all information provided is subject to change without prior notice Designed by Amphenol Socapex
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