Catalogue BLP

Amphenol Socapex │ BOARD LEVEL PRODUCTS

QUICK SELECTION GUIDE

Standard / Approval

HDAS

SMASH

HDB 3 /HSB 3

R-VPX

R-SATA

127/HE8

M55302/140 to /155

MIL-DTL-55302

NFC UTE 93424/ HE801-804-807

NFC-UTE

SATA 3.0

SATA VITA

VITA 46

Not available for SMT version

RoHS

Board configuration Motherboard to daughterboard

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Mezzanine

Stacker

Test only

Test only

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Board to cable Extender / PC

Contact termination Press fit / compliant

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Thru hole soldering

Surface mount

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Crimping Solder cup

Test only

Test only

Contact technology Starclip 6-tines

Brush

Stamped and formed Micro-hyperboloïd

Upon request

Lateral displacement compatible Technical features / accessories Guiding devices

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Polarization keys / keying

Locking system Rackable solution Arrangements Signal Differential pair

Upon request

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Power Coaxial Optical

Upon request Upon request

Pitch / contact pattern Staggered grid

1,905 [.075] 0,9525 [.0375] offset

1,72 x 1,52 [.070x.060]

2,54 [.100] 1,27 [.050] offset

1,8 x 1,8 [.039x.039]

Square grid

1,905 [.075] 0,635 [.025] offset

Chevron grid

Contacts number 1 row

7

Under development

22

17 to 96 80, 144

2 rows 3 rows 4 rows 5 rows

50, 77, 119, 152

102, 202

154

40, 60, 80, 120, 160

253

132, 150, 264, 300, 396, 450

6 rows

8 or 16 columns 3U or 6U

Other

Electrical Current rating per contacts (A) Dielectric Withstanding Voltage (Vrms) Mechanical Electrical security / Backoff Mating / Unmating force (g) Max data rate (Gbps)

4,5

3

2

1,5

3

750

1000

750

1000

4

6,25

10

6,25

Not applicable

1,2mm [.047 in]

1,2mm [.047 in]

1 mm [.039in]

95

95

45

180 500

500

500

100 000

500

20 000

Durability

Environmental Salt spray (hours)

96

96

48

48

96

-65 / +150

-65 / +150

-65 / +125

-55 / +105

-55 / +125

Temperature range (°C) Material / plating Active area (gold thickness)

1µm [.039µin]

1.3µm [.051µin]

1.3µm or 0,5µm [.050µin or .020µin] Tin-lead, pure tin or gold

1.3µm or 0,75µm [.050µin or .030µin]

1µm [.039µin]

Tin lead, bright pure tin, mat tin, gold, Silver-tin

Tin lead, lead free or gold

Tin-lead or lead free Gold or tin lead dip Tin-lead or lead free

Termination area

Brass alloy

Brass alloy

Beryllium copper

Copper alloy

CuSn9P or CuZn

Contact

LCP thermoplastic LCP thermoplastic LCP thermoplastic LCP thermoplastic

DAP thermoset

Housing

Amphenol SOCAPEX

Due to technical progress, all information provided is subject to change without prior notice Designed by Amphenol Socapex

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