Mechanical Performance Clamping force applied onto the heat sink for a thermal clamp of 80 mm ( 3.15 in ) :
Thickness of the board in mm
1,45
1,55
1,60
1,65
1,75
Thickness of the board in inches
(0.057)
(0.061)
(0.063)
(0.065)
(0.069)
Average value in N
250
380
460
520
630
Average value in lbs
(56.25)
(85.50)
(103.50)
(117.00)
(141.75)
Clamping efficiency The efficiency of Amphenol Thermal Clamps has been shown during tests performed on different types of PCB’s fitted with thermal drains. The test results are given as an example in the table below. They cover the following PCB’s : - 200 µm epoxy glass PCB - thermal drain in CIC (Cu/Invar/Cu) These comparative tests have been done with a 1/2 ATR PCB equipped with SMT chips. Results show that with identical power, heating is 50 % lower for Amphenol Thermal Clamps inserted in a water cooled rack.
With thermal clamp
Without thermal clamp
Test Results
0.5 l/mm 12.8 W 24.2 ° C 24.2 ° C 18.6 ° C 23.8 ° C 14.5 ° C
- 12.8 W 20.4 ° C - 42 °C 45.4 ° C 37.6 ° C
water flow total dissipated power room temperature water temperature
average heating maximum heating minimum heating
4
Amphenol ®
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