Amphenol • PCB Connectors
30
SIHD >>> SIGNAL CONTACTS ( ) FEMALE CONTACTS FOR PLUGS WITHOUT GROUND STRIP
Double sided SMT
Double sided SMT
- SMT soldering - Double sided daughter board
- SMT soldering - Double sided daughter board
L
L
- Surface mount area: 0.7x0.8 [.028x.031] - PCB thickness: 4.56 to 5.37 [.180 to .211]
- Surface mount area: 0.7x0.8 [.028x.031] - PCB thickness: 2.3 to 3.2 [.091 to .126]
F1U2
Termination style
F1U1
Termination style
L
L
Double sided SMT
Right angle solder PC tail
L
L
- SMT soldering - Double sided daughter board, offset - Surface mount area: 0.7x0.8 [.028x.031] - PCB thickness: 1.8 to 2.65 [.071 to .104]
- Thru hole soldering - Daughter board - PCB thickness
L
With heat sink: 2.9 to 3.41[.114 to .134] Without heat sink: 1.4 to 1.8 [.055 to.071]
F1U3
Termination style
F1YC
Termination style
L
L
L
L
L
L
L
Right angle solder PC Long tail
L
L
- Thru hole soldering - Daughter board - PCB thickness
Without heat sink: 1.8 to 2.65 [.071 A Plan originel ECHELLE
A Plan originel ECHELLE
DESSIN: le DESSIN: le
Amphenol Socapex
Amphenol Socapex
1,000
TECHNIQUE: TECHNIQUE:
to.104]
1,000
BP 29 - 74311 THYEZ CEDEX
BP 29 - 74311 THYEZ CEDEX
1/1
1/1
F1YL
Termination style
L
L
L
L
F1U1
F1U2
F1U3
F1YC
F1YL
With heat sink: 4.4 [.173] Without heat sink: 2.8 [.110]
L MAX
3.21 [.126]
5.37 [.211]
2.65 [.104]
Without heat sink: 4.6 [.181]
Ø 0.5 ± 0.03 [.020 ± .001]
A Plan originel ECHELLE
DESSIN: le DESSIN: le
TECHNIQUE: Termination section TECHNIQUE:
Amphenol Socapex
0.6 x 0.25 [.024 X .010]
Socapex
1,000
BP 29 - 74311 THYEZ CEDEX
THYEZ CEDEX
Active contact area plating µm [µin] 1/1
2 [.080] Ni + 1 [.039] Au
2 [.080] Ni + 7 [.276] SnPb or bright pure Sn for RoHS version
Termination plating µm [µin]
2 [.080] Ni + 3 [.118] SnPb or bright pure Sn for RoHS version
All dimensions are given for information only and are in mm [inch], except as otherwise specified
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